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FPF2172 IntelliMAXTM Advanced Load Management Products
APRIL 2006
FPF2172 IntelliMAXTM Advanced Load Management Products
Features
1.8 to 5.5V Input Voltage Range Controlled Turn-On 200mA Current Limit Option Undervoltage Lockout Thermal Shutdown <1A Shutdown Current Fast Current limit Response Time 3s to Moderate Over Currents 20ns to Hard Shorts Integrated very low VF Schottky Diode for Reverse Current Blocking
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General Description
The FPF2172 is a load switch which combines the functionality of the IntelliMAXTM series load switch with a very low forward voltage drop Schottky barrier rectifier. The integrated solution provides full protection to systems and loads which may encounter large current conditions in a very compact MLP 3x3 package. This device contain a 0.125 current-limited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. The Schottky diode acts as a barrier so that no reverse current can flow when the MOSFET is off and the output voltage is higher than the input voltage. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous over-current condition causes excessive heating. When the switch current reaches the current limit, the part operates in a constant-current mode to prohibit excessive currents from causing damage. If the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The switch will remain off until the ON pin is cycled. The minimum current limit is 200mA. These parts are available in a space-saving 6L MLP 3x3 package.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies
Typical Application Circuit
TO LOAD VIN VOUT
FPF2172
OFF ON ON GND FLAGB
(c)2006 Fairchild Semiconductor Corporation
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FPF2172 Rev. E
FPF2172 IntelliMAXTM Advanced Load Management Products
Functional Block Diagram
VIN
UVLO
ON
CONTROL LOGIC
CURRENT LIMIT THERMAL SHUTDOWN VOUT FLAGB
GND
Pin Configuration
1 2 3
8
7
6
5
4
3x3 MLP BOTTOM VIEW
Pin Description
Pin
1 2, 8 3, 7 4 5 6
Name
VIN NC VOUT FLAGB GND ON No Connect
Function
Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Fault Output: Active LO, open drain output which indicates an over current supply, under voltage or over temperature state. Ground ON Control Input
FPF2172 Rev.E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Absolute Maximum Ratings
Parameter
VIN, ON, FLAGB to GND VOUT to GND Power Dissipation @ TA = 25C ( note 1) Operating Temperature Range Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM
Min.
-0.3 -0.3 -40 -65 4000 400
Max.
6 20 1.4 85 150 70 -
Unit
V V W C C C/W V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min.
1.8 -40
Max.
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current Shutdown Current Latch-off Current Reverse Block Leakage Current Reverse Breakdown Voltage Dropout Voltage
Symbol
VIN IQ ISHDN ILATCHOFF IR
Conditions
Min.
1.8
Typ.
95 110 50 10 0.3 0.23 0.36 -
Max
5.5 200 1 100 0.4 0.5 1.0 1 1 0.2 0.3 1
Units
V A A A A V V
IOUT = 0mA VON ACTIVE
VIN = 1.8 to 3.3V VIN = 3.3 to 5.5V
20 0.75 1.3 -
VON = VIN, after and overcurrent fault VOUT = 20V, VIN = VON = 0V, TA = 25C IOUT = 250A
VDROP
TA = 25C, IOUT = 150mA TA = 85C, IOUT = 150mA TA = -40C, IOUT = 150mA
ON Input Logic High Voltage (ON) ON Input Logic Low Voltage ON Input Leakage Off Switch Leakage FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current
VIH VIL
VIN = 1.8V VIN = 5.5V VIN = 1.8V VIN = 5.5V VON = VIN or GND
V V A A V A
ISWOFF
VON = 0V, VOUT = 0V VIN = 5V, ISINK = 10mA VIN = 1.8V, ISINK = 10mA VIN = 5V, Switch on
FPF2172 Rev.E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Electrical Characteristics Cont.
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Protections Current Limit Thermal Shutdown
Symbol
ILIM
Conditions
VIN = 3.3V, VOUT = 2.0V Shutdown Threshold Return from Shutdown Hysteresis
Min.
200 1.5 -
Typ.
300 140 130 10 1.6 47 22 20 13 117 10 3 20
Max
400 1.7 20 -
Units
mA C
Under Voltage Shutdown Under Voltage Shutdown Hysteresis Dynamic Turn on time Turn off time VOUT Rise Time VOUT Fall Time Over Current Blanking Time Short Circuit Response Time
UVLO
VIN Increasing
V mV s s s s ms s ns
tON tOFF tR tF tBLANK
RL=500, CL=0.1F RL=500, CL=0.1F RL=500, CL=0.1F RL=500, CL=0.1F VIN = VON = 3.3V. Moderate Over-Current Condition. VIN = VON = 3.3V. Hard Short.
5 -
Note 1: Package power dissipation on 1spuare inch pad, 2 oz copper board.
FPF2172 Rev.E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
100 VON = VIN
120 110 SUPPLY CURRENT (uA)
SUPPLY CURRENT (uA)
95
100 VIN = 5.5V 90 VIN = 1.8V 80 VIN = 3.3V 70
90
85
80 1 2 3 4 SUPPLY VOLTAGE (V) 5 6
60 -40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
2
0.6
SUPPLY CURRENT (uA)
SUPPLY CURRENT (uA)
1.6
0.4
1.2
0.8
VIN = 5.5V
0.2
VIN = 5.5V VIN = 3.3V
0.4 VIN = 3.3V 0 -40 -15 10 35 60 TJ, JUNCTION TEMPERATURE (oC) 85
0 -40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
Figure 3. ISHUTDOWN Current vs. Temperature
Figure 4. ISWITCH-OFF Current vs. Temperature
60 VIN = 3.3V
1.8 1.6 1.4 ON THRESHOLD (V) 1.2 1.0 0.8 0.6 0.4 0.2
SUPPLY CURRENT (uA)
55
50
45
40 -40
0.0
-15 10 35 60 TJ, JUNCTION TEMPERATURE (oC) 85
1.5
2
2.5
3 3.5 4 4.5 VIN, INPUT VOLTAGE (V)
5
5.5
6
Figure 5. Latchoff current vs. Temperature
Figure 6. Input Voltage vs. On Threshold Voltage
FPF2172 Rev.E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
400
400
VIN = 3.3V
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
350
350
300
300
250
250
200 1.5 2 2.5 3 3.5 4 4.5 VIN, INPUT VOLTAGE (V) 5 5.5 6
200 -40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
350
400
IOUT = 150mA
VIN = 3.3V IOUT = 150mA DROPOUT VOLTAGE (mV) 350
DROPOUT VOLTAGE (mV)
325
300
300
275
250
250 1 2 3 4 VIN, INPUT VOLTAGE (V) 5 6
200 -40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
Figure 9. Drop Voltage vs. Input Voltage
Figure 10. Drop Voltage vs. Temperature
40 VIN = 3.3V
1000 VIN = 3.3V TURN ON/OFF TIMES (us)
tFALL 100
DELAY TIMES (us)
30 tON
20 tOFF
10
tRISE
10 -40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
1 -40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
Figure 11. TON/TOff vs. Temperature
Figure 12. TRISE/TFALL vs. Temperature
FPF2172 Rev. E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
15 VIN = 3.3V FLAG-BLANKING TIME (ms) 13
V DRV 2V/DIV FLAGB 2V/DIV IOUT 200mA/DIV VOUT 2V/DIV
-15 10 35 60 o TJ, JUNCTION TEMPERATURE ( C) 85
11
CIN=10uF CL=0.1uF RLOAD=500
9
7
5 -40
5ms/DIV Figure 14. TBLANK Response
Figure 13. TBLANK vs Temperature
VON 2V/DIV
CIN=10uF CL=0.1uF RLOAD=500
VON 2V/DIV
CIN=10uF CL=0.1uF RLOAD=500
IOUT 10mA/DIV
IOUT 10mA/DIV
100us/DIV Figure 15. TON Response
100us/DIV Figure 16. TOFF Response
VIN 2V/DIV IOUT 5A/DIV VOUT 2V/DIV
CIN=10uF CL=0.1uF
VIN 2V/DIV VON 2V/DIV IOUT 200mA/DIV
CIN=10uF CL=0.1uF
20us/DIV Figure 17. Short Circuit Response Time (Output Shorted to GND)
50us/DIV Figure 18. Current Limit Response Time (Output has a 4.7 load)
FPF2172 Rev. E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Description of Operation
The FPF2172 is a current limited switch that protects systems and loads which can be damaged or disrupted by the application of high currents. The core of the device is a 0.125 P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V paired with a low forward voltage drop Schottky diode for reverse blocking. The controller protects against system malfunctions through current limiting, under-voltage lockout and thermal shutdown. The current limit is preset for 200mA.
Current Limiting
The current limit guarantees that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current is 200mA and the maximum current is 400mA. The device has a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred.
Under-Voltage Lockout On/Off Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no under-voltage on VIN or a junction temperature in excess of 150C. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals. When the MOSFET is off, the Schottky diode acts as a barrier so that no reverse current can flow when VOUT is greater than VIN. The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots.
Thermal Shutdown
The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an over-temperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
Fault Reporting
Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. The FLAGB goes LO at the end of the blanking time and is latched LO and ON must be toggled to release it. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply.
Ordering Information
Part
FPF2172
Current Limit [mA]
200
Current Limit Blanking Time [ms]
10
Auto-Restart Time [ms]
NA
ON Pin Activity
Active HI
Top Mark
2172
FPF2172 Rev. E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Application Information
Typical Application
VIN
VOUT
FPF2172
Battery 5.5V OFF ON C1 = 10F 5.5V MAX ON GND FLAGB
R1 = 100K R2 = 110 C2 = 0.1F
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 0.1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop.
Output Capacitor
A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off.
Power Dissipation
During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be typically,
P = I LIM x V DROP = 0.4 x 0.4 = 160mW
(2)
When using the part, attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance.
FPF2172 Rev. E
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FPF2172 IntelliMAXTM Advanced Load Management Products
Dimensional Outline and Pad Layout Package MLP06H
FPF2172 Rev.E
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FPF2172 IntelliMAXTM Advanced Load Management Products
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM
Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER
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SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
LIFE SUPPORT POLICY
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
Rev. I19
FPF2172 Rev.E
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